Purge = More “Good” Wafers out the door
The continuous shrinkage of line width and the use of the new material / process steps drive the need of a tighter wafer environment control. More and more studies show that maintaining an ultra clean FOUP environment can improve process yield in 45nm and below processes. Besides AMC / particle contamination, moisture and oxygen content are two major items to be controlled. Entegris has developed a total solution for customer’s FOUP environment control need on their high-end process. It has been proven effective in the field.
This presentation will explore and present the challenges our Industry are facing related to airborne molecular contamination for 300mm wafers and below. It will address Entegris 300mm Front Opening Unified Pod diffuser technology and barrier materials. Also address the challenges where and when to purge with some customer related results.